Laser cutting-Shenzhen laser source technology Co., Ltd

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FPC series laser cutting machine

The equipment is a special model for flexible circuit board, QR code and characters.

It is mainly used for cutting and forming covering film (CVL), flexible plate (FPC), soft and hard bonding plate (RF), and thin-layer plate. It can also be used for cutting various substrates, such as ceramics, silicon wafers, Teflon, etc.

Equipment characteristics

·Light spot is thin, cold light cutting, and thermal effect is small.

·Fully enclosed light path, graphics can be spliced, high precision.

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Equipment characteristics

01 Powerful laser performance

Non contact cutting, thin light spot, small thermal effect

02 High precision and efficiency

Equipped with linear motor, high speed, high-precision production

03 Professional cutting software

CCD vision, splicing and cutting, powerful manufacturing process.

04 Customizable high

Optional nanosecond, ultraviolet, CO2 and fiber lasers.

project	Technical participation
Equipment model	LTC-MU5050
Processing range	500mm*500mm
laser power	3W/30w (optional)
Laser wavelength	Green light/ultraviolet (optional)
Repetitive positioning accuracy	≤ ± 2um
Minimum line width	20 um
Minimum coding size	0.3mm*0.3mm
Highest speed platform	1200mm/s
Maximum acceleration	10000mm/s
vision system	CCD
Supporting file formats	Common file formats such as DXF
Environmental requirements	Temperature 22 ℃～ 25 ℃, humidity<55%
Power demand	220V /50Hz
Equipment dimensions (reference)	L1500mmW1600mmH1700mm

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Laser cutting machine